1. 2. 3. material content data sheet sales product name ice3b0565 issued 14. november 2014 ma# MA001044382 package pg-dip-8-13 weight* 556.90 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 3.262 0.59 0.59 5858 5858 leadframe inorganic material phosphorus 7723-14-0 0.054 0.01 96 non noble metal zinc 7440-66-6 0.215 0.04 386 non noble metal iron 7439-89-6 4.297 0.77 7716 non noble metal copper 7440-50-8 174.475 31.33 32.15 313294 321492 wire noble metal gold 7440-57-5 0.238 0.04 0.04 428 428 encapsulation organic material carbon black 1333-86-4 1.095 0.20 1966 plastics epoxy resin - 35.392 6.36 63551 inorganic material silicondioxide 60676-86-0 328.378 58.96 65.52 589649 655166 leadfinish non noble metal tin 7440-31-5 7.496 1.35 1.35 13460 13460 plating noble metal silver 7440-22-4 0.796 0.14 0.14 1429 1429 glue plastics epoxy resin - 0.181 0.03 325 noble metal silver 7440-22-4 1.026 0.18 0.21 1842 2167 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and does not use any exemption. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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